Memory First Process Flow and Device

ABSTRACT

A semiconductor device and method of making the same are disclosed. The semiconductor device includes a memory gate on a charge storage structure formed on a substrate, a select gate on a gate dielectric on the substrate proximal to the memory gate, and a dielectric structure between the memory gate and the select gate, and adjacent to sidewalls of the memory gate and the select gate, wherein the memory gate and the select gate are separated by a thickness of the dielectric structure. Generally, the dielectric structure comprises multiple dielectric layers including a first dielectric layer adjacent the sidewall of the memory gate, and a nitride dielectric layer adjacent to the first dielectric layer and between the memory gate and the select gate. Other embodiments are also disclosed.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.16/009,543, filed Jun. 15, 2018, which is a continuation of U.S.application Ser. No. 15/281,010, filed Sep. 29, 2016, now U.S. Pat. No.10,014,380, issued Jul. 03, 2018, which is a continuation-in-part ofU.S. application Ser. No. 15/181,138, filed Jun. 13, 2016, now U.S. Pat.No. 9,917,166, issued Mar. 13, 2018, which is a continuation of U.S.patent application Ser. No. 13/715,577, filed Dec. 14, 2012, now U.S.Pat. No. 9,368,606, issued Jun. 14, 2016, all of which are incorporatedherein in their entirety.

TECHNICAL FIELD

This disclosure relates generally to improved semiconductor device andmethods and apparatus for making such semiconductor device.

BACKGROUND

A Flash memory permits stored data to be retained even if power to thememory is removed. A Flash memory cell stores data either by storingelectrical charge in an electrically isolated floating gate of a fieldeffect transistor (FET) or by storing electrical charge in a dielectriclayer underlying a control gate of a FET. The stored electrical chargecontrols the threshold of the FET, thereby controlling the memory stateof the Flash memory cell.

A Flash memory cell is commonly programmed using hot carrier injectionto inject charge carriers either onto a floating gate or into chargetrapping sites in a dielectric layer underlying a control, gate. Highdrain and gate voltages are used to speed up the programming process.Thus, the Flash memory cell conducts a high current during programming,which is undesirable in low voltage and low power applications.

A split-gate cell is a type of Flash memory cell, in which a select gateis placed adjacent a memory gate, providing lower current duringhot-carrier-based programming operation. During the programming of thesplit-gate cell, the select gate is biased at a relatively low voltage,and only the memory gate is biased at the high voltage to provide thevertical electric field necessary for hot-carrier injection. Since theacceleration of the carriers takes place in the channel region mostlyunder the select gate, the relatively low voltage on the select gateabove that region results in more efficient carrier acceleration in thehorizontal direction compared to the conventional memory cell. Thatmakes the hot-carrier injection more efficient with lower current andlower power consumption during the programming operation. A split-gatecell may be programmed using techniques other than hot-carrierinjection, and depending on the technique, any advantage over theconventional Flash memory cell during the programming operation mayvary.

Fast read time is another advantage of the split-gate cell. Because theselect gate is in series with the memory gate, the erased state of thememory gate can be near or in depletion mode (i.e., threshold voltage,Vt, less than zero volt). Even when the erased memory gate is in suchdepletion mode, the select gate in the off state prevents the channelfrom conducting substantial current. With the threshold voltage of theerase state at or below zero, the threshold voltage of the programmedstate does not need to be very high while still providing a reasonableread margin between the erased and the programmed states. The resultingvoltages applied to both the select gate and the memory gate in readoperation are less than or equal to the supply voltage. Therefore, nothaving to pump the supply voltage to a higher level makes the readoperation faster.

It is also becoming increasingly common to monolithically incorporatemultiple field-effect devices on the same substrate as the memory cellsto provide improved efficiency, security, functionality, andreliability. As such, many processes are tailored in order to conformwith standard CMOS fabrication. For example, a chip with split-gatecells may also include other field-effect devices to perform variouslogic and power control processes.

These other field-effect devices may include transistors tailored forhigh speed operation, while other transistors are tailored for handlinghigher-than-normal operating voltages. However, incorporating both onthe same substrate along with the split-gate cell is challenging as eachrequires different fabrication parameters. Accordingly, there is a needfor device and methods for integrating these split-gate cells and otherfield-effect devices with improved performance, cost, andmanufacturability.

SUMMARY

A semiconductor device is provided. According to embodiments, thesemiconductor device includes a memory gate disposed in a first regionof the semiconductor device. The memory gate may include a first gateconductor layer formed, for instance, of polycrystalline silicon(“poly”) disposed over a charge trapping dielectric. A select gate maybe disposed in the first region of the semiconductor device adjacent toa sidewall of the memory gate. A sidewall dielectric may be disposedbetween the sidewall of the memory gate and the select gate.Additionally, the device may include a logic gate disposed in a secondregion of the semiconductor device that comprises the first gateconductor layer.

A method of manufacturing a semiconductor device having a first regionand a second region is provided. According to the method, the secondregion is masked and a layer of gate conductor is disposed above acharge trapping dielectric in the first region. The gate conductor layercan be etched to form a memory gate. A sidewall dielectric can bedisposed on a sidewall of the memory gate and a second layer of gateconductor can be formed. The second layer of gate conductor can then beetched to form a select gate adjacent to the side wall of the memorygate. The first region can then be masked and a logic gate can be formedin the second region of the semiconductor device.

According to other embodiments, the semiconductor device includes amemory gate on a charge storage structure formed on a substrate, aselect gate on a gate dielectric on the substrate proximal to the memorygate, and a dielectric structure between the memory gate and the selectgate, and adjacent to sidewalls of the memory gate and the select gate,wherein the memory gate and the select gate are separated by a thicknessof the dielectric structure. Generally, at least a portion of thedielectric structure is positioned or extends between the charge storagestructure and the gate dielectric. In one embodiment, the dielectricstructure comprises one or more dielectric layers including a firstoxide layer adjacent the sidewall of the memory gate, a second oxidelayer adjacent the sidewall of the select gate, and a silicon nitride(SiN) or silicon oxynitride (SiON) layer between the first and secondoxide layers. Where the dielectric structure includes a silicon nitridelayer, the silicon nitride can include a Si₃N₄ layer or a silicon richnitride layer.

Further features and advantages of embodiments of the invention, as wellas the structure and operation of various embodiments of the invention,are described in detail below with reference to the accompanyingdrawings. It is noted that the invention is not limited to the specificembodiments described herein. Such embodiments are presented herein forillustrative purposes only. Additional embodiments will be apparent to aperson skilled in the relevant art(s) based on the teachings containedherein.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of the invention will now be described, by way of exampleonly, with reference to the accompanying schematic drawings in whichcorresponding reference symbols indicate corresponding parts. Further,the accompanying drawings, which are incorporated herein and form partof the specification, illustrate embodiments of the present invention,and, together with the description, further serve to explain theprinciples of the invention and to enable a person skilled in therelevant art(s) to make and use the invention.

FIG. 1 depicts a cross-section of a split-gate memory cell according tovarious embodiments.

FIG. 2 is a circuit diagram of a memory cell in a memory array accordingto various embodiments.

FIG. 3 depicts a cross-section of a semiconductor device according tovarious embodiments.

FIG. 4 is a functional block diagram of a memory device according tovarious embodiments.

FIGS. 5A-5I depict a cross-section of a memory device at various pointsduring its manufacture according to various embodiments.

FIGS. 6A-6D depict a cross-section of a memory device at various pointsduring its manufacture according to various embodiments.

FIG. 7 is a flowchart depicting a method of manufacturing asemiconductor device according to various embodiments.

FIG. 8 is a flowchart depicting a method of manufacturing asemiconductor device according to various embodiments.

FIG. 9 is a flowchart depicting a method of manufacturing asemiconductor device according to various embodiments.

FIG. 10 is a flowchart depicting a method of manufacturing asemiconductor device according to various embodiments.

FIGS. 11A-11E depict a cross-section of a memory device at variouspoints during its manufacture according to various embodiments.

FIG. 12 depicts a cross-section of a memory device having a memory gateand select gate separated by a dielectric structure according to variousembodiments.

FIG. 13 is a flowchart depicting a method of manufacturing the memorydevice of FIG. 12 according to various embodiments.

FIGS. 14A-14G depict a cross-section of the memory device of FIG. 12 atvarious points during its manufacture according to various embodiments.

The features and advantages of embodiments of the present invention willbecome more apparent from the detailed description set forth below whentaken in conjunction with the drawings. In the drawings, like referencenumbers generally indicate identical, functionally similar, and/orstructurally similar elements.

DETAILED DESCRIPTION

This specification discloses one or more embodiments that incorporatethe features of this invention. The disclosed embodiment(s) merelyexemplify the present invention. The scope of the present invention isnot limited to the disclosed embodiment(s). The present invention isdefined by the claims appended hereto.

The embodiment(s) described, and references in the specification to “oneembodiment,” “an embodiment,” “an example embodiment,” etc., indicatethat the embodiment(s) described may include a particular feature,structure, or characteristic, but every embodiment may not necessarilyinclude the particular feature, structure, or characteristic. Moreover,such phrases are not necessarily referring to the same embodiment.Further, when a particular feature, structure, or characteristic isdescribed in connection with an embodiment, it is understood that it iswithin the knowledge of one skilled in the art to effect such feature,structure, or characteristic in connection with other embodimentswhether or not explicitly described.

Before describing the various embodiments in more detail, furtherexplanation shall be given regarding certain terms that may be usedthroughout the descriptions.

The term “etch” or “etching” is used herein to generally describe afabrication process of patterning a material, such that at least aportion of the material remains after the etch is completed. Forexample, it should be understood that the process of etching siliconinvolves the steps of patterning a masking layer (e.g., photoresist or ahard mask) above the silicon, and then removing the areas of silicon nolonger protected by the masking layer. As such, the areas of siliconprotected by the mask would remain behind after the etch process iscomplete. However, in another example, etching may also refer to aprocess that does not use a mask, but still leaves behind at least aportion of the material after the etch process is complete.

The above description serves to distinguish the term “etching” from“removing.” When etching a material, at least a portion of the materialremains behind after the process is completed. In contrast, whenremoving a material, substantially all of the material is removed in theprocess. However, in some embodiments, ‘removing’ is considered to be abroad term that may incorporate etching.

During the descriptions herein, various regions of the substrate uponwhich the field-effect devices are fabricated are mentioned. It shouldbe understood that these regions may exist anywhere on the substrate andfurthermore that the regions may not be mutually exclusive. That is, insome embodiments, portions of one or more regions may overlap. Althoughup to three different regions are described herein, it should beunderstood that any number of regions may exist on the substrate and maydesignate areas having certain, types of devices or materials. Ingeneral, the regions are used to conveniently describe areas of thesubstrate that include similar devices and should not limit the scope orspirit of the described embodiments.

The terms “deposit” or “dispose” are used herein to describe the act ofapplying a layer of material to the substrate. Such terms are meant todescribe any possible layer-forming technique including, but not limitedto, thermal growth, sputtering, evaporation, chemical vapor deposition,epitaxial growth, electroplating, etc. According to various embodiments,for instance, deposition may be performed according to any appropriatewell-known method. For instance, deposition can comprise any processthat grows, coats, or transfers material onto a substrate. Somewell-known technologies include physical vapor deposition (PVD),chemical vapor deposition (CVD), electrochemical deposition (ECD),molecular beam epitaxy (MBE), atomic layer deposition (ALD), andplasma-enhanced CVD (PECVD), amongst others.

The “substrate” as used throughout the descriptions is most commonlythought to be silicon. However, the substrate may also be any of a widearray of semiconductor materials such as germanium, gallium arsenide,indium phosphide, etc. In other embodiments, the substrate may beelectrically non-conductive such as a glass or sapphire wafer.

As used herein, “mask” may comprise any appropriate material that allowsfor selective removal (e.g., etching) of an unmasked portion a material.According to some embodiments, masking structures may comprise aphotoresist such as Poly(methyl methacrylate) (PMMA), Poly(methylglutarimide) (PMGI), a Phenol formaldehyde resin, a suitable epoxy, etc.

Before describing such embodiments in more detail, it is instructive topresent an example memory cell and environment in which the presentembodiments may be implemented.

FIG. 1 illustrates an example of a split-gate non-volatile memory cell100. Memory cell 100 is formed on a substrate 102, such as silicon.Substrate 102 is commonly p-type or a p-type well while a first dopedsource/drain region 104 and a second doped source/drain region 106 aren-type. However, it is also possible for substrate 102 to be n-typewhile regions 104 and 106 are p-type.

Memory cell 100 includes two gates, a select gate 108 and a memory gate110. Each gate may be a doped gate conductor layer formed by well known,for example, deposit and etch techniques to define the gate structure.Select gate 108 is disposed over a dielectric layer 112. Memory gate 110is disposed over a charge trapping dielectric 114 having one or moredielectric layers. In one example, charge trapping dielectric 114includes a charge trapping silicon nitride layer sandwiched between twosilicon dioxide layers to create a three-layer stack collectively andcommonly referred to as “ONO.” Other charge trapping dielectrics mayinclude a silicon-rich nitride film, or any film that includes, but isnot limited to, silicon, oxygen, and nitrogen in variousstoichiometries. A vertical dielectric 116 is also disposed betweenselect gate 108 and memory gate 110 for electrical isolation between thetwo gates. In some examples, vertical dielectric 116 and charge trappingdielectric 114 are the same dielectric, while other examples form onedielectric before the other (e.g., they can have different dielectricproperties.) As such, vertical dielectric 116 need not include the samefilm structure as charge trapping dielectric 114. Regions 104 and 106are created by implanting dopants using, for example, an ionimplantation technique. Regions 104 and 106 form the source or drain ofthe split-gate transistor depending on what potentials are applied toeach. In split gate transistors, for convenience, region 104 is commonlyreferred to as the drain, while region 106 is commonly referred to asthe source, independent of the relative biases. It is to be understoodthat this description is meant to provide a general overview of commonsplit-gate architecture and that, in actual practice, many more detailedsteps and layers are provided to form the final memory cell 100.

An example write, read, and erase operation will now be described as itrelates to memory cell 100. In order to write a bit in memory cell 100,a positive voltage on the order of 5 volts, for example, is applied toregion 106 while region 104 and substrate 102 are grounded. A lowpositive voltage on the order of 1.5 volts, for example, is applied toselect gate 108 while a higher positive voltage on the order of 8 volts,for example, is applied to memory gate 110. As electrons are acceleratedwithin a channel region between the source and drain, some of them willacquire sufficient energy to be injected upwards and get trapped insidecharge trapping dielectric 114. This is known as hot electron injection.In one example of charge trapping dielectric 114, the electrons aretrapped within a nitride layer of charge trapping dielectric 114. Thisnitride layer is also commonly referred to as the charge trapping layer.The trapped charge within charge trapping dielectric 114 store the“high” bit within memory cell 100, even after the various supplyvoltages are removed.

In order to “erase” the stored charge within memory cell 100 and returnthe state of memory cell 100 to a “low” bit, a positive voltage on theorder of 5 volts, for example, is applied to region 106 while region 104is floated or at a certain bias, and select gate 108 and substrate 102are typically grounded. A high negative voltage on the order of −8volts, for example, is applied to memory gate 110. The bias conditionsbetween memory gate 110 and region 106 generate holes throughband-to-band tunneling. The generated holes are sufficiently energizedby the strong electric field under memory gate 110 and are injectedupwards into charge trapping dielectric 114. The injected holeseffectively erase the memory cell 100 to the “low” bit state.

In order to “read” the stored bit of memory cell 100, a low voltage isapplied to each of the select gate, memory gate, and region 104 in therange between zero and 3 volts, for example, while region 106 andsubstrate 102 are typically grounded. The low voltage applied to thememory gate is chosen so that it lies substantially equidistant betweenthe threshold voltage necessary to turn on the transistor when storing a“high” bit and the threshold voltage necessary to tarn on the transistorwhen storing a “low” bit in order to clearly distinguish between the twostates. For example, if the application of the low voltage during the“read” operation caused substantial current to flow between regions 104and 106, then the memory cell holds a “low” bit and if the applicationof the low voltage during the “read” operation does not causesubstantial current to flow between regions 104 and 106, then the memorycell holds a “high” bit.

FIG. 2 illustrates an example circuit diagram 200 that comprises amemory cell 100 including connections to various metal layers in asemiconductor device. Only a single memory cell 100 is illustrated,however, as evidenced by the ellipses in both the X and Y direction, anarray of memory cells may be connected by the various lines running inboth the X and Y directions. In this way, one or more memory cells 100may be selected for reading, writing, and erasing bits based on the bitline (BL) and source line (SL) used.

An example source line (SL) runs along the X direction and is formed ina first metal layer (M1). Source line (SL) may be used to makeelectrical connection with doped region 106 of each memory cell 100along a row extending in the X direction.

An example bit line (BL) runs along the Y direction and is formed in asecond metal layer (M2). Bit line (BL) may be used to make electricalconnection with doped region 104 of each memory cell 100 along a columnextending in the Y direction.

It is to be understood that the circuit connections shown in FIG. 2 areonly exemplary and that the various connections could be made indifferent metal layers than those illustrated. Furthermore, although notdepicted, memory cells 100 may be arrayed in the Z direction as wellformed within multiple stacked layers.

FIG. 3 illustrates an example semiconductor device 300 that includesboth memory circuitry 302 and peripheral circuitry 304 in the samesubstrate 102. In this example, substrate 102 includes a core region 302and a periphery region 304. Core region 302 includes a plurality ofmemory cells 100 that may operate similarly to those previouslydescribed. It should be understood that the cross-section of FIG. 3 isonly exemplary, and that core region 302 and periphery region 304 may belocated in any area of substrate 102 and may be made up of variousdifferent regions. Furthermore, core region 302 and periphery region 304may exist in the same general area of substrate 102.

Substrate 302—and indeed substrates in general as used throughout thedescription—can be silicon according to various embodiments. However,the substrate 302 may also be any of a wide array of semiconductormaterials such as germanium, gallium arsenide, indium phosphide, etc. Inother embodiments, the substrate 302 may be electrically non-conductivesuch as a glass or sapphire wafer.

Periphery region 304 may include integrated circuit components such asresistors, capacitors, inductors, etc., as well as transistors. In theillustrated embodiment, periphery region 304 includes a plurality ofhigh-voltage transistors 306 and low-voltage transistors 308. In oneexample, high-voltage transistors 306 exist in a separate region ofsubstrate 102 than low-voltage transistors 308. High-voltage transistors306 are capable of handling voltages up to 20 volts in magnitude, forexample, while low-voltage transistors 308 operate at a faster speed,but cannot operate at the same high voltages as high-voltage transistors306. In an embodiment, low voltage transistors 308 are designed to havea shorter gate length than high voltage transistors 306. High-voltagetransistors 306 are commonly characterized as having a thicker gatedielectric 310 than the gate dielectric of low-voltage transistors 308.As shown in FIG. 3, low voltage transistors 308 have a narrower widththan high-voltage transistors 306, but this need not be the case.According to some embodiments, low-voltage 308 transistors can be widerthan high voltage transistors 306 or, alternatively, low-voltagetransistors 308 and high-voltage transistors 306 can have the samewidth.

During the descriptions herein, various regions of the substrate uponwhich the field-effect devices are fabricated are mentioned. Forinstance, with respect to FIG. 3, core region 302 and periphery region304 were described. It should be understood that these regions may existanywhere on the substrate and furthermore that the regions may not bemutually exclusive. That is, in some embodiments, portions of one ormore regions may overlap. Although up to three different regions aredescribed herein, it should be understood that any number of regions mayexist on the substrate and may designate areas having certain types ofdevices or materials. In general, the regions are used to convenientlydescribe areas of the substrate that include similar devices and shouldnot limit the scope or spirit of the described embodiments.

FIG. 4 is a functional block diagram of a memory device 402 according toembodiments of the present invention. As shown, memory device 402includes a memory array 404, high voltage control logic 406, and lowvoltage control logic 408. According to various embodiments, the memoryarray 404 may comprise a number of memory cells 100 and may bephysically located in a core region 302 of memory device 402. Highvoltage control logic 406 may comprise a number of high-voltagetransistors 306, which can be used to control and/or drive portions ofthe memory array 404. Additionally, the high voltage control logic 406may be physically located in the periphery 304 of the memory device 402.Similarly to the high voltage control logic 406, the low voltage controllogic 408 may comprise a number of low voltage transistors 308, whichcan be used to control and/or drive portions of the memory array 404.The low voltage control logic 408 may also be located in the periphery304 of the memory device. According to various embodiments, the highvoltage control logic 406 and the low voltage, control logic 408 arelocated in different portions of the periphery region 304.

FIGS. 5A-5I depict a cross-section of a semiconductor device 500 atvarious points during its manufacture according to embodiments of thepresent invention. FIG. 5A depicts device 500 after a number ofstructures have been formed. As shown in FIG. 5A, the device 500includes a substrate 502 which comprises three different regions 504,506, and 508.

A first or memory region 504 of the substrate may be used for memorycomponents. According to various embodiments, the first region 504comprises a memory core region where a plurality memory cells (e.g.,memory cell 100) can be formed. For instance, according to someembodiments, the first region may be used to form a number of selectgate 108/memory gate 110 pairs.

Logic and/or control circuitry may be formed in periphery, whichincludes second and third regions 506 and 508, respectively according tovarious embodiments. The second region 506 may comprise the high voltagecontrol logic region 406 and the third region 508 may comprise the lowvoltage control logic (e.g., region 408).

As shown in FIG. 5A, a gate dielectric 512 b has been formed in secondregion 506 and another gate dielectric 512 c has been formed in thethird region 508. Gate dielectric 512 a (not shown in this figure) canbe created at a different time according to various embodiments. Each ofthe gate dielectrics 512 a, 512 b, and 512 c may comprise any suitabledielectric material such as, for instance and oxide. According tovarious embodiments the gate dielectrics 512 b and 512 c may bedifferent thicknesses, but this need not be the case. The gatedielectrics 512 b and 512 c may be formed through any well-known method.For instance, the dielectrics may be grown on the substrate 502 andcomprise an oxide of the substrate material (e.g., silicon oxide). It isalso possible, however, for the gate dielectrics 512 b and 512 c to bedisposed on the substrate and comprise an oxide of a different materialthan the substrate. Additionally, dielectrics 512 b and 512 c maycomprise the same or different material and may be formed at the sametime or at different times according to various embodiments. A gatedielectric 512 a (not shown in this figure) may later be disposed in thefirst region 504 according to various embodiments as well. The gatedielectric 512 a may be thinner than either of the of the gatedielectrics 512 a and 512 b according to some embodiments, but it alsomay be the same thickness as either or both of gate dielectrics 512 aand 512 b.

A charge trapping dielectric 514 has been disposed above the substrate502 in the first region 504, as shown in FIG. 5A. According to variousembodiments, the charge trapping dielectric comprises one or more layersof dielectric such as ONO, as described above. For instance, the chargetrapping dielectric 514 may comprise a first dielectric layer 514 a, acharge trapping layer 514 b, and a second dielectric layer 514 c.Regardless of the specific composition of the charge trapping dielectric514, it preferably contains at least one charge trapping layer 514 b.The charge trapping layer may be formed of a nitride or silicon richnitride, and may include multiple layers of different nitrides accordingto some embodiments.

A gate conductor layer 516 has been formed over all three regions 504,506, and 508 of the device 500. According to various embodiments, thegate conductor layer 516 may be disposed or deposited according to anyappropriate well-known method such as deposition. Deposition cancomprise any process that grows, coats, or transfers material onto asubstrate. Some well-known technologies include physical vapordeposition (PVD), chemical vapor deposition (CVD), electrochemicaldeposition (ECD), molecular beam epitaxy (MBE), atomic layer deposition(ALD), and plasma-enhanced CVD (PECVD), amongst others.

A cap layer 518 has been formed over all three regions 504, 506, and 508of device 500. According to various embodiments, the cap layer 518 maycomprise a layer of nitride 518 a disposed on over a layer of dielectric518 b. A mask 520 is disposed over the second region 506 and the thirdregion 508. Mask 520 may additionally be patterned in the first region504. Both mask 520 may comprise any suitable material that allows forselective removal (e.g., etching) of the unmasked portion of the gateconductor layer 516. According to some embodiments, masking structuresmay comprise a photoresist such as Poly(methyl methacrylate) (PMMA),Poly(methyl glutarimide) (PMGI), a Phenol formaldehyde resin, a suitableepoxy, etc.

FIG. 5B depicts a cross section of device 500 after the gate conductor516 is removed from the unmasked portion of the first region.Additionally, the charge trapping dielectric 514 disposed between memorygates 522 a and 522 b is removed. According to some embodiments, theremoved portion of the gate conductor 516 and the charge trappingdielectric 514 is removed by any of a number of appropriate etchingmethods. For instance, the gate conductor layer 516 may be etched usingCl2, KOH, TMAH (tetra-methyl-amino-hydroxyl), or using gas phase etchingwith, for instance, H2, HCl, O2, H2O (vapor or gas), O3, HF, F2, andCarbon-Fluoride compounds with Cl2 and XeF2. Additionally, according tosome embodiments, a combination of etching products may be used.

As depicted in FIG. 5B, the remaining portions of the gate conductor 516in the first region 504 form memory gates 522 a/522 b. Additionally, adielectric 524 has been formed on the sidewalls of the memory gates andthe charge tapping dielectric 514. According to various embodiments, thedielectric may comprise a single layer dielectric or a multiple layerdielectric such as ONO, described above. Additionally, a select gatedielectric 512 a may be grown in the first region 504 according tovarious embodiments.

In FIG. 5C, a second gate conductor layer 526 has been formed over thememory gates 522 in the first region 504. According to some embodiments,the second gate conductor layer 526 may be substantially conformal tothe other structures formed in the first region, but this need not bethis case in all embodiments. Second gate conductor layer 526 has alsobeen formed over the second region 506 and the third region 508, asshown in FIG. C.

FIG. 5D depicts the partial removal of the second gate conductor layer526. As can be seen, a portion of the second gate conductor layer 526remains disposed on the sidewalls of the memory gates 522 a and 522 b.Gate conductor portions 528 a and 528 b will eventually comprise theselect gates for memory cells to be formed using memory gates 522 a and522 b. Portions 530 a and 530 b, however, are superfluous. Superfluousportions 530 a and 530 b can be removed by masking portions 528 a and528 b with mask 532, as shown in FIG. 5E. Once masked, the superfluousportions 530 a and 530 b can be removed as well as the unmasked portionof dielectric 524. The result of this removal is depicted in FIG. 5F.

FIG. 5G depicts a cross section of device 500 after several additionalsteps have been performed according to various embodiments. In FIG. 5G,the first and third regions 504 and 508 are masked with mask 536.Additionally, mask 536 may be patterned over second region 506 over caplayer 518. The portion of cap layer 518 and of the second gate conductor516 not beneath the patterned mask 536 is removed from the second region506, as shown. After gate 544 in the second region is defined, thelightly doped drain and source masks and implants are performed to formthe junctions next to gates 544. After the scenario depicted in FIG. 5G,mask 536 can be removed from the device 500 and the nitride portion 518a can be removed from the cap layer 518 in all three regions using, forinstance, a nitride wet strip.

FIG. 5H depicts a cross section of device 500 after gate 544 has beendefined by the removal of a portion of the second gate conductor 516from the second region 506. Additionally, a mask 546 has been disposedin the second region 506 in order to protect the gate 544 from theprocess steps of forming logic gates in the third region 508.Additionally, mask 546 has been patterned in the third region 508 inorder to facilitate formation of a gate 548 in the third region 508.

FIG. 5I depicts a cross section of device 500 after a second logic gate548 has been defined in the third region 508. Additionally, mask 546 isremoved from the first region 504 and the second region 506. Anyremaining portions of cap layer 518 are also shown as removed. At thispoint device 500, thus, comprises a pair of memory cells 550 a d 550 bdisposed in the first region 504 of the device 500. Each of the memorycells 550 a and 550 b comprises a memory gate 522 a and 522 b (generallyreferred to herein as “memory gate 522”) and a select gate 534 a and 534b, respectively. A dielectric 524 a and 524 b disposed on a sidewall ofthe memory gate electrically isolates the select gates 534 a and 534 bfrom their associated memory gates 522 a and 522 b. Charge trappingdielectrics 514 a and 514 b are disposed beneath the memory gates 522 aand 522 b. As discussed above, the charge trapping dielectrics 514 a and514 b may comprise one 01 more dielectric layer that includes a chargetrapping layer. Additionally, the charge trapping dielectrics 514 a and514 b are separate and independently formed form the sidewalldielectrics 524 a and 524 b.

In addition to the memory cells 550 a and 550 b, the device 500comprises a first gate 544 disposed in the second region 506 and asecond gate 548 disposed in the third region 508. According to variousembodiments, the second region may be configured to accommodatehigh-voltage circuitry and logic and, accordingly, the gate 544 may bedesigned to handle high-voltage. For instance, gate 544 may be longerthan gate 548 in order to facilitate the use of higher current in thesecond region 506. Third region 508 may be configured to accommodaterelatively lower voltage logic and/or circuitry. Accordingly, gate 548may be thinner than gate 544 according to various embodiments.

It should be understood, that FIGS. 5A-5I depict a simplified version ofdevice 500 with only a pair of memory cells 550 a and 550 b and a singlelogic gate 542 and 540 in each of the second region 506 and the thirdregion 508 for ease of explanation. A person of ordinary skill in theart, however, would understand that device 500 could contain a largenumber of memory cells, logic cells, and other components in each of thefirst region 504, second region 506, and third region 508.

FIGS. 6A-6D depict an alternative to the method of forming the selectgates 534 a and 543 b on the sidewalls of the memory gates 522 a and 522b depicted in FIGS. 5A-51. As shown in FIG. 6A, device 600 may comprisea substrate 602 and memory gates 610 a and 610 b. Disposed between eachof the memory gates 610 a and 610 b is a charge trapping dielectrics 603a and 603 b. In this case, the charge trapping dielectrics 603 a and 603b each comprise a top dielectric 604 a and 604 b, a nitride layer 606 aand 606 b, and a bottom dielectric 608 a and 608 b. According to someembodiments the bottom dielectric 608 a and 608 b may be in addition toan additional gate dielectric (not shown). According to variousembodiments, the top dielectrics 604 a and 604 b and the bottomdielectrics 608 a and 608 b may comprise oxides of any suitable materialsuch as silicon oxide. Additionally, the charge trapping dielectrics maycomprise additional layers. For instance, it may be desirable to includemultiple nitride layers 606 a and 606 b to act as charge trappinglayers. The dielectric layers 604 a, 604 b, 608 a, and 608 b maycomprise dielectrics of the substrate or some other material and may beformed according to any of a number of conventional means. The nitridelayers 606 a and 606 b may comprise silicon nitride, silicon richnitride, or any material suitable to act as a charge trapping layer.

FIG. 6A also depicts a dielectrics 620 a and 620 b (collectivelyreferred to as dielectric 620 herein) disposed on the sidewall memorygate structures 610 a and 610 b. Dielectric 620 may comprise a singlelayer of dielectric or multiple layers such as the ONO described above.Over the dielectric 620, and the memory gate structures 610 a and 610 b,a layer of gate conductor 612 is disposed. Additionally, a mask 614 hasbeen formed over a portion of the gate conductor 612 disposed on theinner sidewalls of the memory gates 610 a and 610 b.

As shown in FIG. 6B, a portion of the gate conductor layer 612 can beremoved from the unmasked area of device 600. However, some of the gateconductor in the unmasked portion is purposefully not removed on theouter sidewalls of the memory gates 610 a and 610 b. The retainedportion of the gate conductor 612 on the outer sidewalls of memory gates610 a and 610 b will form the select gates 616 a and 616 b.

As shown in FIG. 6C, mask 614 is removed leaving gate conductor 612exposed. Additionally, new masks 618 a and 618 b have been formed overthe select gates 616 a and 616 b and a portion of memory gates 610 a and610 b. The remaining gate conductor 612 can then be removed from theinner sidewall portion of memory gates 610 a and 610 b, as is shown inFIG. 6D.

FIG. 6D depicts two split-gate memory cells 622 a and 622 b formedaccording to the alternative process depicted in FIGS. 6A-6D with thecap layer 518 on 610 a and 610 b removed. Additionally, as shown in FIG.6D dielectric 620 is removed from the sidewalls between the memory gates610 a and 610 b. As shown in FIG. 6D, each of the split-gate memorycells includes a memory gate 610 a and 610 b disposed above a chargetrapping dielectric 603 a and 603 b. The charge trapping dielectric 603a and 603 b is itself comprised of several dielectric layers. Forinstance, the charge trapping dielectric may include a top dielectriclayer 604 a and 604 b, a nitride layer 606 a and 606 b, and a bottomdielectric layer 608 a and 608 b, as shown.

A select gate 616 a and 616 b has been formed a sidewall of each of thememory gates 610 a and 610 b. A dielectric 620 a and 620 b electricallyisolates the select gates 616 a and 616 b from the memory gates 610 aand 610 b. According to various embodiments, the dielectric 620 a and620 b may comprise one or more dielectric layers, but has been formedindependently of the charge trapping dielectric 603 a and 603 b.

For simplicity's sake, FIGS. 5A-5I and 6A-6D do not expressly depictsource and drain regions in devices 500 and 600. However, it should beunderstood that appropriate source and drain regions (e.g., regions 104and 106) would be formed in devices 500 and 600 during the manufacturingprocess by any appropriate method such as ion implantation, for example.

FIG. 7 is a flowchart depicting a method 700 of forming a semiconductordevice according to various embodiments. The discussion of FIG. 7 willmake reference to FIGS. 5A-5I, but it should be understood that method700 is not limited to the specific embodiment depicted in FIGS. 5A-5I,but is more generally applicable.

As shown in FIG. 7, the method 700 may begin by masking a peripheralregion of the device 500 at step 702. The peripheral region may includeany portion of the device 500 that is not the memory region or firstregion 504. For instance, in device 500, the peripheral region couldinclude second region 506 and third region 508.

According to various embodiments, step 702 may occur after gatedielectrics 512 a, 512 b, and 512 c have been formed in each of thefirst region 504, second region 506, and third region 508. Additionally,prior to performing step 702, a charge trapping dielectric may be formedin the first region 504. As described above, the charge trappingdielectric may comprise one or more layers of dielectric such as ONO, asdescribed above. For instance, the charge trapping dielectric 514 maycomprise a first dielectric layer 514 a, a nitride layer 514 b, and asecond dielectric layer 514 c. In addition to the charge trapping layer,a first, gate conductor layer 516 may be formed in each of the firstregion 504, the second region 506, and the third region 508 prior toperforming step 702.

At step 704, a memory gate 522 can be formed from a first gate conductor516. This can be accomplished by masking a portion of the gate conductor516 in the first region 504 and etching the unmasked gate conductor 516to define a memory gate 522. Additionally, it should be noted, that theportion of the charge trapping layer not beneath the memory gate 522 canalso be removed from the first region 504 by, for instance, etchingduring the process of forming the memory gate 522.

At step 706, a dielectric 524 is disposed on a sidewall of memory gate522. The dielectric 524 may comprise one or more dielectric layers. Forinstance, the dielectric 524 may include a nitride layer and one or twodielectric layers. The dielectric can be disposed on the sidewall of thememory gate 522 by, for instance, forming a dielectric layer over thememory gate, then dry etching to remove any of the dielectric 524 thatis not on the sidewall of the memory gate 522. Additionally, a selectgate dielectric 512 a may be formed in the first region at this timeaccording to various embodiments.

At step 708, a second gate conductor layer 526 is disposed over thedielectric 524. According to some embodiments, the second gate conductorlayer 526 may be substantially conformal to the other structures formedin the first region, but this need not be this case in all embodiments.

At step 710, a select gate 534 is formed from the second gate conductor526. According to some embodiments. The select gate 534 can be formed byremoving gate conductor from the first region 504, while retaining aportion of the second gate conductor layer 526 remains disposed on thesidewalls of the memory gate 522. A superfluous portion 530 of the gateconductor 526 can be removed form one of the sidewalls of the memorygate by masking a select gate portion 534 and etching the rest. At step712, the first region, which now contains a largely completed memorycell, can be masked to allow the formation of a logic gate in the secondregion 506 at step 714.

FIG. 8 is a flowchart depicting a method 800 of forming a select gateaccording to various embodiments. The discussion of FIG. 8 will makereference to FIGS. 6A-6D, but it should be understood that method 800 isnot limited to the specific embodiment depicted in FIGS. 6A-6D, but ismore generally applicable.

According to method 800, a source side of memory gate 610 is masked atstep 802. Prior to performing step 802, however, a device 600 may beformed. Device 600 may comprise, a substrate 602 and memory gates 610 aand 610 b (referred to in general as “memory gate 610” herein). Disposedbetween each of the memory gate 610 and the substrate is a chargetrapping dielectric 603. The charge trapping dielectrics 603 may includea top dielectric 604, a nitride layer 606, and a bottom dielectric 608.According to some embodiments the bottom dielectric 608 may be inaddition to an additional gate dielectric. Additionally, the chargetrapping dielectric 603 may comprise additional layers. For instance, itmay be desirable to include multiple nitride layers 606 to act as chargetrapping layers. The dielectric layers 604 and 608 may comprise oxidesof the substrate or some other material and may be formed according toany of a number of conventional means. The nitride layer 606 maycomprise silicon nitride, silicon rich nitride, or any material suitableto act as a charge trapping layer.

A dielectric 620 may also have been disposed over the memory gatestructure 610 prior to step 802. Dielectric 620 may comprise a singlelayer of dielectric or multiple layers such as the ONO described above.Over the dielectric 620, a layer of gate conductor 612 is disposed.Additionally, a gate conductor layer 612 may be disposed over the memorygate structure 610 prior to performing step 802.

At step 804, a drain (unmasked in this case) is removed (e.g., etched)to define a select gate 616 on the sidewall of the memory gate 610. Theselect gate 616 can be defined by removing a portion of the gateconductor 612 from the unmasked region. However, some of the gateconductor 612 is purposefully left on the sidewall of the memory gate610 in order to form the select gate 616.

At step 806, the drain side of the memory gate can be masked to protectthe select gate 616. Next, the remaining gate conductor 612 can beremoved from the source side of the memory gate at step 808.

FIG. 9 is a flowchart depicting a method 900 for forming a chargetrapping dielectric in a first region 504 of a semiconductor device 500according to various embodiments. The device 500 may include a firstregion 504, a second region 506, and a third region 508 as depicted, forinstance, in FIGS. 5A-5I.

At step 902, the charge trapping dielectric 514 is formed in each of thefirst region 504, the second region 506, and the third region 508. Thecharge trapping dielectric may include one or more dielectric layersaccording to various embodiments. For instance, according to someembodiments, the charge trapping dielectric may include a top dielectric514 a, a nitride layer 514 b, and a bottom dielectric 514 c.Additionally, the step of forming the charge trapping dielectric maycomprise depositing each of the top dielectric 514 a, the nitride layer514 b, and the bottom dielectric 514 c separately.

At step 904, the first region 504 is masked to protect it from processsteps that will be carried out in the second region 506 and the thirdregion 508. At step 906, the charge trapping dielectric 514 is removedfrom the second region and a gate dielectric 512 b can be formed at step908.

At step 910, the charge trapping dielectric 514 can be removed from thethird region and a gate dielectric 512 c can be formed in the thirdregion at step 912. After step 912, the device 500 includes a chargetrapping dielectric in the first region separately formed gatedielectrics 510 b and 510 c in the second region 506 and the thirdregion 508.

As noted above, according to some embodiments, silicon rich nitride(SiRN) can be used for the charge trapping layer 514 b. SiRN can beadvantageous to use as the charge trapping layer in a split-gate memorycell because it has been found to have better reliability, a fastererase speed, and a lower erase current. While SiRN has some propertiesthat make it good to use as the charge trapping layer 514 b, it also hassome properties that make it difficult to use. For instance, unlikeother nitrides, SiRN is slightly conductive. Accordingly, it isimportant to ensure that the charge trapping layer 514 b of each memorycell (e.g., 550 a or 550 b) is isolated from the other memory cells inorder to avoid leakage. FIG. 10 is a flowchart depicting a method 1000of isolating the charge trapping layers in each of the memory cells fromeach other according to various embodiments. FIGS. 11A-11E depict asemiconductor device 1100 at various points during method 1000.Accordingly, FIG. 10 will be discussed in conjunction with FIGS.11A-11E.

FIG. 11A depicts a semiconductor device 1100. The device 1100 includes asubstrate 1102 and shallow trench isolation (STI) regions 1104 a and1104 b (collectively referred to herein as STI regions 1104). STIregions 1104 function to electrically isolate adjacent semiconductorcomponents (not shown) from each other.

According to method 1000, at step 1002, a nitride layer 1106 is formedover the STI regions 1104 of the semiconductor device 1100 after bottomdielectric. The result of this step is depicted in FIG. 11B. The nitridelayer 1106 may comprise SiRN or any other suitable nitride. As shown inFIG. 11B, the nitride layer 1106 is conformal with the top ofsemiconductor device 1100.

At step 1004, a sacrificial layer 1108 may be formed over the nitridelayer 1106. The sacrificial layer 1108 may comprise any suitablematerial. For instance, according to some various embodiments, thesacrificial layer 1108 may comprise an oxide, BARC, photoresist, etc.The device 1100 is depicted after step 1004 in FIG. 11C.

At step 1006, portions of the sacrificial layer 1108, the nitride layer1106, and the STI regions 1104 can be removed. As shown in FIG. 11D, theremoved portions of the sacrificial layer 1108, the nitride layer 1106,and the STI regions 1104 cause a discontinuity in the nitride layer1106. According, to various embodiments, the removed portions 1108,1106, and 1104 can be removed by dry or wet etch, polish back, or anyother appropriate means. At step 1008, the remaining portion of thesacrificial layer 1108 can be removed from the device 1100, as depictedin FIG. 11E.

In another aspect the present disclosure is directed to a memory deviceincluding a split-gate non-volatile memory cell having a memory gate andselect gate separated by a multi-layer dielectric structure including anitride layer, such as a silicon nitride (SiN) or silicon oxynitride(SiON) layer, parallel to sidewalls of the memory gate and the selectgate, where the memory gate and the select gate are separated by a totalthickness of the layers of the dielectric structure.

FIG. 12 illustrates a cross-sectional schematic view of one embodimentof such a memory device 1200. Referring to FIG. 12, each memory cell1202 is formed on a substrate 1204, such as silicon. Substrate 1204 iscommonly a p-type or includes a p-type well (not shown) in which thememory cell is formed, and a first doped source region 1206 and a seconddoped drain region 1208 are n-type created by implanting dopants using,for example, an ion implantation technique. However, it is also possiblefor substrate 1204 to be n-type while regions 1208 and 1206 are p-type.

Memory cell 1202 includes two gates, a select gate 1210 and a memorygate 1212 overlying a single, contiguous channel 1213 in the substrate1204. In some embodiments, such that shown in FIG. 12, there adifference in height between a top surface of the select gate and thetop surface of the memory gate. In particular, the top surface of theselect gate 1210 proximal to the memory gate 1212 extends above the topsurface of the memory gate, to provide isolation against shorts orleakage between a SALICIDE 1240 subsequently formed on the top surfaceof the select gate and the SALICIDE on the top surface of the memorygate. Each gate 1210 and 1212 may be a doped gate conductor layerformed, for example, by well-known deposition and etch techniques todefine the gate structure. Select gate 1210 is disposed over a gatedielectric 1214. Memory gate 1212 is disposed over a charge storagestructure 1216 having one or more dielectric layers, including a tunnellayer 1218, a blocking layer 1220 and a charge storage layer 1222sandwiched therebetween. In one example, the charge storage structure1216 includes a nitride charge storage layer 1222 sandwiched between asilicon dioxide tunnel layer 1218 and a silicon dioxide blocking layer1220, to create a three-layer stack collectively and commonly referredto as “ONO.” The nitride charge storage layer can include one or morelayers of silicon nitride (SiN) or silicon oxynitride (SiON) includingsilicon, oxygen, and nitrogen in various stoichiometries to providedesired trap density and to locate a centroid of the trapped chargewithin the top of the nitride layer, further away from the substrate fora given charge storage layer thickness to improve charge retention. Forexample, in one embodiment the nitride layer can be a bilayer includingan oxygen rich first SiN or SiON layer deposited on the lower dielectriclayer, and an oxygen lean, silicon rich second SiN or SiON layerdeposited on the first layer, which is trap dense. By oxygen-rich it ismeant wherein a concentration of oxygen in the oxygen-rich first SiN orSiON layer is from about 15% to about 40%, whereas a concentration ofoxygen in the oxygen-lean second layer is less than about 5%.

Other charge storage structures may include a polysilicon charge storagelayer 1222 sandwiched between the tunnel layer 1218 and a multilayerblocking layer 1220, to form a floating gate of a floating gate NVMtransistor. The multilayer blocking layer 1220 can include one or moresilicon oxide, silicon nitride or silicon oxynitride dielectric layers.For example, in one embodiment the multilayer blocking layer 1220 caninclude an oxide-nitride-oxide (ONO) stack.

In the embodiment described above, the tunnel layer 1218 and theblocking layer 1220, can include one or more layers of a dielectricmaterial such as silicon dioxide. In other embodiments, either or bothof the tunnel layer 1218 and the blocking layer 1220 can include a highK dielectric. Suitable high K dielectrics include aluminum oxide orhafnium based materials such as HfSiON, HfSiO or HfO, Zirconium basedmaterial such as ZrSiON, ZrSiO or ZrO, and Yttrium based material suchas Y₂O₃.

The memory cell 1202 further includes a first sidewall spacer orinter-gate dielectric structure 1224 disposed between select gate 1210and memory gate 1212 for electrical isolation between the two gates, anda second sidewall spacer 1225 surrounding both the select gate 1210 andmemory gate 1212. In some embodiments, such as that shown in FIG. 12 thesecond sidewall spacer 1225 includes a spacer 1225 a or portion of thespacer adjacent the sidewall of the select gate 1210, and between thesidewall of the select gate and the top surface of the memory gate 1212,to provide further isolation against shorts or leakage between theSALICIDE 1240 formed on the top surface of the select gate and theSALICIDE 1240 on the top surface of the memory gate. Although the secondsidewall spacers 1225 and 1225 a are shown in FIG. 12 as being formedfrom or including a single layer of material, it will be appreciatedthat this need not be the case. According to some embodiments the secondsidewall spacers 1225 and 1225 a can include one or more layers ofsequentially deposited dielectric materials, such as silicon oxides(SiO2), silicon nitride (SiN) and silicon oxynitride (SiN).

Generally, the dielectric structure 1224 further extends between thecharge storage structure 1216 and the gate dielectric 1214, and includesone or more dielectric layers substantially parallel to sidewalls of thememory gate 1212 and the select gate 1210 and substantiallyperpendicular to a surface 1227 of the substrate 1204 such that thememory gate and the select gate are separated by a total thickness ofthe layers of the dielectric structure. The dielectric structure canhave a thickness of from about 50 Å to about 300 Å. In some embodiments,the dielectric structure 1224 includes a first dielectric layer 1226adjacent the sidewall of the memory gate 1212, a second dielectric layer1228 adjacent the sidewall of the select gate 1210, and a nitride layer1230, such as a silicon nitride (SiN) layer or a silicon oxynitride(SiON) layer, between the first and second dielectric layers. Where thedielectric structure includes a silicon nitride layer, the siliconnitride can include a Si₃N₄ layer or a silicon rich nitride (SiRN)layer. By SiRN layer is meant a silicon nitride of having the chemicalformula of Si_(x)N_(y), where x is greater than or equal to y. Suitablematerials for the first and second dielectric layers 1226, 1228, caninclude silicon dioxide (SiO₂). As shown in FIG. 12, the nitride layer1230 of the dielectric structure 1224 is discontiguous with andseparated from the nitride charge storage layer 1222 by the firstdielectric layer 1226. Nevertheless, in some examples one or more layersof the dielectric structure 1224 have the same stoichiometry, as thelayers 1218, 1220, 1222, of the charge storage structure 1216 and/or thegate dielectric 1214 and are formed contiguous and/or concurrentlytherewith. For example, in one embodiment the second dielectric layer1228 comprises an L-shaped second dielectric layer including a firstportion formed on or over the nitride dielectric layer 1230 parallel tothe sidewall of the memory gate 1212 and a second portion on over thesurface 1226 of the substrate 1204, which is included within orsubstantially forms the gate dielectric 1214.

The memory device 1200 further includes multiple interlevel dielectriclayers (ILD 1232 a, 1232 b) including a dielectric material such assilicon dioxide (SiO₂) deposited or formed over the surface 1226 of thesubstrate 1204 and the memory cells 1202 formed thereon. A number offirst vias 1234 electrically connect landing pads 1236 and a source line1238 formed from a first metal or M1 layer on the first ILD 1232 a toself-aligned silicides or SALICIDES 1240 on the drain region 1208 andsource region 1206 respectively. A bitline 1242 formed from a secondmetal or M2 layer on the second ILD 1232 b is electrically coupled tothe landing pads 1236 through a number of second vias 1244.

An embodiment of a method of manufacturing the memory device of FIG. 12according to various embodiments will now be described in detail withreference to FIG. 13 and FIGS. 14A through 14G. FIG. 13 is a flowchartillustrating an embodiment of a method or process flow for manufacturinga split-gate non-volatile memory cell having a memory gate and selectgate separated by a multi-layer dielectric structure including a SiN orSiON nitride layer. FIGS. 14A-14G are block diagrams illustratingcross-sectional views of a portion of a memory device 1400, includingmultiple split-gate non-volatile memory cells, two of which are shown,during fabrication of the memory device according to the method of FIG.13.

Referring to FIG. 13 and FIG. 14A, the process begins with forming achannel 1402 in surface 1404 of a substrate 1406. (step 1302) Thechannel 1402 may be doped with either P-type or N-type dopant impurityatoms. For example, in one embodiment, the channel 1402 is P-type dopedwith boron having a concentration in the range of 1×10¹⁵-1×10¹⁹atoms/cm³. Alternatively, the channel 1402 can be doped with phosphorousor arsenic. Charge storage structures 1408 are formed on the surface1404 of the substrate 1406 over a first portion of the channel 1402 a(step 1304), and memory gates 1410 formed on the charge storagestructures. (step 1306) Generally, this is accomplished by sequentiallydepositing or forming over the surface 1404 of the substrate 1406 atunnel layer 1412, a charge storage layer 1414, and a blocking layer1416 from which the charge storage structures 1408 will be formed and apolysilicon gate layer from which memory gates 1410 will be formed. Asnoted above, the tunnel layer 1412 can include SiO₂ either thermallygrown or deposited by CVD, PECVD or ALD. The charge storage layer 1414can be a nitride charge storage layer including one or more layers ofSiN or SiON, deposited by CVD, PECVD or ALD, or a polysilicon floatinggate layer deposited by MBE. The blocking layer 1416 can include one ormore layers of either a thermally grown or deposited SiO₂ and/or a highK dielectric deposited by CVD, PECVD or ALD. A memory gate hardmask 1420is then formed over the polysilicon gate layer by depositing, forexample, a thin silicon oxide layer 1420 a and a silicon nitride layer1420 b and patterning the layers using a photoresist and knownphotolithographic and etching techniques. Alternatively, the hardmaskcan include any combination of one or more dielectric layers includingsilicon oxide, silicon nitride and or silicon oxynitride. For example,nitride layers can be etched using a known low pressure nitride etch ata moderate power (about 500 W) in a plasma of a fluorine containing gas,such as CF_(4,) or CHF₃; silicon dioxides can be either wet or dryetched; and polysilicon containing layers can dry etched using knownpolysilicon etch chemistries, such as CHF₃ or C₂H₂ or HBr/O₂. After thelayers have been etched or patterned to form the memory gates 1410 andcharge storage structures 1408 shown in FIG. 14A, any remainingphotoresist is stripped and a post resist strip wet clean performed,which generally results in a thin oxide 1422 remaining on the surface1404 of the substrate 1406.

Next, inter-gate, multilayer dielectric structures are formed adjacentto sidewalls of the memory gates 1410 and charge storage structures1408. Referring to FIGS. 13 and 14B this is accomplished using any knownoxidation formation process, to deposit a first dielectric layer 1424comprising silicon dioxide on the sidewalls of the memory gates 1410.(step 1308). A nitride dielectric layer 1426, including one or morelayers of SiN, SiRN or SiON, is formed on the first dielectric 1424 byCVD or furnace deposition followed by an anisotropic spacer etch to stopon the SiO2 of the first dielectric and the thin oxide 1422 on thesurface 1404 of the substrate 1406. (step 1310) As noted above inconnection with FIG. 12, the nitride dielectric layer 1426 isdiscontiguous with and separated from the charge storage layer 1414 bythe first dielectric layer 1424. Referring to FIGS. 13 and 14C a seconddielectric layer 1428 is formed over the nitride dielectric layer 1426by thermally growing or depositing a silicon dioxide layer using anyknown oxide process. (step 1312) As noted above in connection with FIG.12, in some embodiments the second dielectric layer 1428 comprises anL-shaped second dielectric layer including a first portion formed on orover the nitride dielectric layer 1426 parallel to the sidewall of thememory gate 1410 and a second portion on over the surface 1404 of thesubstrate 1406, which is included within or substantially concurrentlyforms gate dielectrics 1430 for select gates of the memory cells.

Referring again to FIG. 13 and to FIGS. 14C and 14D, select gates 1432are formed over gate dielectrics 1430 overlying a second portion of thechannel 1402 b and adjacent to the second dielectric layer 1428, theselect gates proximal to the memory gates 1410 and separated therefromby a total thickness of the first and second dielectric layers 1424,1428, and the nitride dielectric layer 1426. (step 1314) This isaccomplished through an etching technique that also exposes one or moredrain regions into which implanting is done using a dopant of theappropriate type at an energy and to a concentration selected to formone or more drains 1436. (step 1316)

Next, referring to FIGS. 13 and 14E the select gates 1432 and memorygates 1410 are covered with an array source mask 1438 and thepolysilicon layer 1434 over a source region removed, a dopant of theappropriate type implanted at an energy and to a concentration selectedto form a source 1440 and the array source mask 1438 removed. (step1318)

Referring to FIGS. 13 and 14F the memory gate hardmask 1420 is removedand second sidewall spacers 1442 formed surrounding both the select gate1432 and memory gate 1410. (step 1320) As noted above, in someembodiments, such as that shown in FIG. 14F the second sidewall spacers442 includes a spacer 1442 a or portion of the spacer adjacent thesidewall of the select gate 1432, and between the sidewall of the selectgate and the top surface of the memory gate 1410, to provide furtherisolation against shorts or leakage between a SALICIDE subsequentlyformed on the top surface of the select gate and the SALICIDE on the topsurface of the memory gate. Optionally, as in the embodiment shown,during removal of the memory gate hardmask 1420 a portion of thedielectric structure not between the select gates 1432 and memory gates1410 may be removed. The memory gate hardmask 1420 and portions of thedielectric structure can be removed using any of the oxide and nitrideetch techniques described above. Generally, the process for forming thesecond sidewall spacers 1442 can include deposition of a silicon nitridelayer in a CVD furnace, followed by a known nitride spacer etch tosubstantially remove the silicon nitride from the surface 1404 of thesubstrate 1406 to form the rounded second sidewall spacers 1442 shown inFIG. 14F

Next, referring to FIG. 13 and to FIGS. 14G, a self-aligned silicide orSALICIDE 1444 is formed over the surface 1404 of the substrate 1406 inall source and drain regions 1440, 1436, and over the memory gates 1410and select gates 1432. (step 1322) The silicide process may be anycommonly employed in the art, including for example a pre-clean etch,metal deposition, anneal and wet strip.

Finally, referring to FIGS. 12 and 13 the ILDs 1232 a, 1232 b are formedover the surface 1227 of the substrate 1204 and the memory cells 1202(step 1324), and vias 1234, 1244, landing pads 1236, source line 1238and bitline 1242 are formed. Generally, the ILDs 1232 a, 1232 b caninclude any suitable dielectric material such as silicon dioxide (SiO₂),and can be deposited or formed using suitable, known depositiontechnique, including CVD. The vias can be formed by etching openings inthe ILDs and depositing metal in the openings using PVD or CVD. Thelanding pads, bitline and source line can be formed by depositing metallayers using PVD or CVD, and patterning the metal layers using knownphotolithographic and metal etching techniques.

It is to be appreciated that the Detailed Description section, and notthe Summary and Abstract sections, is intended to be used to interpretthe claims. The Summary and Abstract sections may set forth one or morebut not all exemplary embodiments of the present invention ascontemplated by the inventor(s), and thus, are not intended to limit thepresent invention and the appended claims in any way.

Thus, split-gate non-volatile memory cell having a memory gate andselect gate separated by a multi-layer dielectric structure including aSiN/SiON dielectric layer and methods of making the same have beendisclosed. Embodiments of the present invention have been describedabove with the aid of functional building blocks illustrating theimplementation of specified functions and relationships thereof. Theboundaries of these functional building blocks have been arbitrarilydefined herein for the convenience of the description. Alternateboundaries can be defined so long as the specified functions andrelationships thereof are appropriately performed.

The foregoing description of the specific embodiments will so fullyreveal the general nature of the invention that others can, by applyingknowledge within the skill of the art, readily modify and/or adapt forvarious applications such specific embodiments, without undueexperimentation, without departing from the general concept of thepresent invention. Therefore, such adaptations and modifications areintended to be within the meaning and range of equivalents of thedisclosed embodiments, based on the teaching and guidance presentedherein. It is to be understood that the phraseology or terminologyherein is for the purpose of description and not of limitation, suchthat the terminology or phraseology of the present specification is tobe interpreted by the skilled artisan in light of the teachings andguidance.

The breadth and scope of the present invention should not be limited byany of the above-described exemplary embodiments, but should be definedonly in accordance with the following claims and their equivalents.

1-20. (canceled)
 21. A method of fabricating a semiconductor device,comprising: forming a multi-layered charge storage structure over achannel in a substrate including; forming a nitride layer includingsilicon rich nitride over the channel and a shallow trench isolation(STI), wherein the STI is disposed to separate the semiconductor devicefrom an adjacent semiconductor device; forming a sacrificial layer overthe nitride layer; removing completely the sacrificial layer and thenitride layer disposed over the STI; and removing the sacrificial layerover the channel; forming a memory gate on the charge storage structure;forming a dielectric structure adjacent to a sidewall of the memorygate, the dielectric structure comprising a plurality of dielectriclayers substantially parallel to the sidewall of the memory gate; andforming a select gate on a gate dielectric on the substrate adjacent tothe dielectric structure, proximal to the memory gate and separatedtherefrom by a total thickness of the dielectric structure.
 22. Themethod of claim 21, wherein forming the dielectric structure comprisesforming at least one L-shaped dielectric layer including a first portionsubstantially parallel to the sidewall of the memory gate and a secondportion on the surface of the substrate, and wherein the gate dielectriccomprises the second portion of the L-shaped dielectric layer.
 23. Themethod of claim 21, wherein the sacrificial layer includes at least oneof an oxide layer, a photoresist layer, and a bottom anti-reflectantcoating (BARC) layer.
 24. The method of claim 21, wherein the STIincludes a top surface having a higher elevation than the channel. 25.The method of claim 22, wherein forming the dielectric structure furthercomprises forming a second dielectric layer substantially parallel tothe first portion of the L-shaped dielectric layer, and a thirddielectric layer between the L-shaped dielectric layer and the seconddielectric layer.
 26. The method of claim 21, further comprising aninitial step of forming the channel in the surface of the substrate, andwherein forming the memory gate comprises forming the memory gateoverlying a first portion of the channel, and wherein forming the selectgate comprises forming the select gate overlying a second portion of thechannel.
 27. The method of claim 21, wherein forming the select gatecomprises forming a select gate having a top surface proximal to thememory gate that is higher than a top surface of the memory gate, andfurther comprising forming a spacer adjacent to a sidewall of the selectgate, and between the sidewall of the select gate and the top surface ofthe memory gate.
 28. The method of claim 21, further comprising forminga first self-aligned silicide (SALICIDE) on a top surface of the memorygate and a second SALICIDE on a top surface of the select gate.
 29. Asemiconductor device, comprising: a channel formed in a substrate; amemory gate on a charge storage structure disposed over a first portionof the channel, wherein the charge storage structure includes a siliconrich nitride layer; a select gate on a gate dielectric on the surface ofthe substrate over a second portion of the channel; and a dielectricstructure between the memory gate and the select gate, the dielectricstructure comprising multiple layers including a first dielectric layeradjacent to a sidewall of the memory gate, a second dielectric layeradjacent a sidewall of the select gate, and a nitride dielectric layerbetween the first and second dielectric layers, wherein at least aportion of the dielectric structure is positioned between the chargestorage structure and the gate dielectric.
 30. The semiconductor deviceof claim 29, wherein the second dielectric layer comprises an L-shapedsecond dielectric layer including a first portion on the nitridedielectric layer parallel to the sidewall of the memory gate and asecond portion on the surface of the substrate over the second portionof the channel, and wherein the gate dielectric comprises the secondportion of the L-shaped second dielectric layer.